DISCO Corporation
Native name
株式会社ディスコ
TypePublic KK
TYO: 6146
ISINJP3548600000
IndustrySemiconductor
FoundedMay 5, 1937 (1937-05-05) in Kure city, Hiroshima as Dai-Ichi Seitosho Company
FounderMitsuo Sekiya
Headquarters
Omori-Kita, Ōta, Tokyo 162-8557
,
Japan
Area served
Worldwide
Key people
Hitoshi Mizorogi
(Chairman of the Board)
Kazuma Sekiya
(President and CEO)
Products
RevenueIncrease JPY ¥253.78 billion
(US$ 2.21 billion) (FY 2021)
Increase JPY ¥66.21 billion
(US$ 576 million) (FY 2021)
Number of employees
4,091 (as of March 31, 2021)
WebsiteOfficial website
Footnotes / references
[1][2]

DISCO Corporation (株式会社ディスコ, Kabushiki-gaisha Disuko) is a Japanese precision tools maker, especially for the semiconductor production industry.

The company makes dicing saws and laser saws to cut semiconductor silicon wafers and other materials; grinders to process silicon and compound semiconductor wafers to ultra-thin levels; polishing machines to remove the grinding damage layer from the wafer back-side and to increase chip strength.[2]

The company's Kuwabata plant in Kure, Hiroshima

History

The company was founded as Daiichi-Seitosho in May 1937, as an industrial abrasive wheel manufacturer.[3]

After World War II Japan faced a construction boom which also helped DISCO to boost its sales. The company's grinder discs were in high demand from utility companies, which needed them to manufacture watt-meters.[4]

In December 1968 the company developed and released an ultra-thin resinoid cutting wheel, Microncut. The wheel contained diamond powder and as a result it was capable of making sharp, precision cuts as demanded in the semiconductor manufacturing process. There were no cutting machines available in the market on which ultra-thin precision wheels could be mounted and run, DISCO decided to develop its own machine in 1975. The cutting machine, DAD-2h, received instant recognition from semiconductor companies, including Texas Instruments.[3]

The company adopted the name of DISCO Corporation in May 1977,[3] was listed with the Japan Securities Dealers' Association in October 1989, and entered the First Section of the Tokyo Stock Exchange in December 1999.

References

  1. ↑ "Corporate Outline". DISCO Corporation. Retrieved September 23, 2017.
  2. 1 2 "Company Profile". Nikkei Asian Review. Nikkei Inc. Retrieved September 23, 2017.
  3. 1 2 3 Ishikawa, Akira; Nej, Tai (2004). Top Global Companies in Japan. World Scientific. pp. 64–67. ISBN 978-981-238-684-7.
  4. ↑ Nakayama, Wataru; Boulton, William; Pecht (June 25, 1999). The Japanese Electronics Industry. CRC Press. p. 38. ISBN 978-1-58488-026-4.
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