Design flow

Major steps in the IC design flow

A typical IC design cycle involves several steps:

1. System specification
   1. Feasibility study and die size estimate
   2. Function analysis
2. Architectural or system-level design
3. Logic design
   1. Analogue design, simulation, and layout
   2. Digital design and simulation
   3. System simulation, emulation, and verification
4. Circuit design
   1. Digital design synthesis
   2. Design for testing and automatic test pattern generation
   3. Design for manufacturability
5. Physical design
   1. Floorplanning
   2. Place and route
   3. Parasitic extraction
6. Physical verification and signoff
   1. Static timing
   2. Co-simulation and timing
7. Mask data preparation (layout post-processing)
   1. Chip finishing with tape out
   2. Reticle layout
   3. Layout-to-mask preparation
8. Reticle fabrication
9. Photomask fabrication
10. Wafer fabrication
11. Packaging
12. Die test
    1. Post silicon validation and integration
    2. Device characterization
    3. Tweak (if necessary)
13. Chip deployment
    1. Datasheet generation (usually a PDF file)
    2. Ramp up
    3. Production
    4. Yield analysis / warranty analysis reliability
    5. Failure analysis on any returns
    6. Plan for next generation chip using production information if possible

Focused ion beams may be used during chip development to establish new connections in a chip.^[1][2]

Summary

Roughly saying, digital IC design can be divided into three parts.

• Electronic system-level design: This step creates the user functional specification. The user may use a variety of languages and tools to create this description. Examples include a C/C++ model, VHDL, SystemC, SystemVerilog Transaction Level Models, Simulink, and MATLAB.
• RTL design: This step converts the user specification (what the user wants the chip to do) into a register transfer level (RTL) description. The RTL describes the exact behavior of the digital circuits on the chip, as well as the interconnections to inputs and outputs.
• Physical circuit design: This step takes the RTL, and a library of available logic gates (standard cell library), and creates a chip design. This step involves use of IC layout editor, layout and floor planning, figuring out which gates to use, defining places for them, and wiring (clock timing synthesis, routing) them together.

Note that the second step, RTL design, is responsible for the chip doing the right thing. The third step, physical design, does not affect the functionality at all (if done correctly) but determines how fast the chip operates and how much it costs.

A standard cell normally represents a single logic gate. The use of standard cells allows the chip's design to be split into logical and physical levels. A fabless company would normally only work on the logical design of a chip, determining how cells are connected and the functionality of the chip, while following design rules from the foundry the chip will be made in, while the physical design of the chip, the cells themselves, are normally done by the foundry and it comprises the physics of the transistor devices and how they are connected to form a logic gate.

Foundries supply libraries of standard cells to fabless companies, for design purposes and to allow manufacturing of their designs using the foundry's facilities. A Process design kit (PDK) may be provided by the foundry and it may include the standard cell library as well as the specifications of the cells, and tools to verify the fabless company's design against the design rules specified by the foundry as well as simulate it using the foundry's cells. PDKs may be provided under non-disclosure agreements.

Requirements

Before an architecture can be defined some high level product goals must be defined. The requirements are usually generated by a cross functional team that addresses market opportunity, customer needs, feasibility, and much more. This phase should result in a product requirements document.

Architecture

The architecture defines the fundamental structure, goals and principles of the product. It defines high level concepts and the intrinsic value proposition of the product. Architecture teams take into account many variables and interface with many groups. People creating the architecture generally have a significant amount of experience dealing with systems in the area for which the architecture is being created. The work product of the architecture phase is an architectural specification.

Micro-architecture

The micro-architecture is a step closer to the hardware. It implements the architecture and defines specific mechanisms and structures for achieving that implementation. The result of the micro-architecture phase is a micro-architecture specification which describes the methods used to implement the architecture.

Implementation

In the implementation phase the design itself is created using the micro-architectural specification as the starting point. This involves low level definition and partitioning, writing code, entering schematics and verification. This phase ends with a design reaching tapeout.

Bringup

After a design is created, taped-out and manufactured, actual hardware, 'first silicon', is received which is taken into the lab where it goes through bringup. Bringup is the process of powering, testing and characterizing the design in the lab. Numerous tests are performed starting from very simple tests such as ensuring that the device will power on to much more complicated tests which try to stress the part in various ways. The result of the bringup phase is documentation of characterization data (how well the part performs to spec) and errata (unexpected behavior).

Productization

Productization is the task of taking a design from engineering into mass production manufacturing. Although a design may have successfully met the specifications of the product in the lab during the bringup phase there are many challenges that product engineers face when trying to mass-produce those designs. The IC must be ramped up to production volumes with an acceptable yield. The goal of the productization phase is to reach mass production volumes at an acceptable cost.

Sustaining

Once a design is mature and has reached mass production it must be sustained. The process must be continually monitored and problems dealt with quickly to avoid a significant impact on production volumes. The goal of sustaining is to maintain production volumes and continually reduce costs until the product reaches end of life.

Microarchitecture and system-level design

The initial chip design process begins with system-level design and microarchitecture planning. Within IC design companies, management and often analytics will draft a proposal for a design team to start the design of a new chip to fit into an industry segment. Upper-level designers will meet at this stage to decide how the chip will operate functionally. This step is where an IC's functionality and design are decided. IC designers will map out the functional requirements, verification testbenches, and testing methodologies for the whole project, and will then turn the preliminary design into a system-level specification that can be simulated with simple models using languages like C++ and MATLAB and emulation tools. For pure and new designs, the system design stage is where an Instruction set and operation is planned out, and in most chips existing instruction sets are modified for newer functionality. Design at this stage is often statements such as encodes in the MP3 format or implements IEEE floating-point arithmetic. At later stages in the design process, each of these innocent looking statements expands to hundreds of pages of textual documentation.

RTL design

Upon agreement of a system design, RTL designers then implement the functional models in a hardware description language like Verilog, SystemVerilog, or VHDL. Using digital design components like adders, shifters, and state machines as well as computer architecture concepts like pipelining, superscalar execution, and branch prediction, RTL designers will break a functional description into hardware models of components on the chip working together. Each of the simple statements described in the system design can easily turn into thousands of lines of RTL code, which is why it is extremely difficult to verify that the RTL will do the right thing in all the possible cases that the user may throw at it.

To reduce the number of functionality bugs, a separate hardware verification group will take the RTL and design testbenches and systems to check that the RTL actually is performing the same steps under many different conditions, classified as the domain of functional verification. Many techniques are used, none of them perfect but all of them useful – extensive logic simulation, formal methods, hardware emulation, lint-like code checking, code coverage, and so on.

A tiny error here can make the whole chip useless, or worse. The famous Pentium FDIV bug caused the results of a division to be wrong by at most 61 parts per million, in cases that occurred very infrequently. No one even noticed it until the chip had been in production for months. Yet Intel was forced to offer to replace, for free, every chip sold until they could fix the bug, at a cost of $475 million (US).

Physical design

Physical design steps within the digital design flow

RTL is only a behavioral model of the actual functionality of what the chip is supposed to operate under. It has no link to a physical aspect of how the chip would operate in real life at the materials, physics, and electrical engineering side. For this reason, the next step in the IC design process, physical design stage, is to map the RTL into actual geometric representations of all electronics devices, such as capacitors, resistors, logic gates, and transistors that will go on the chip.

The main steps of physical design are listed below. In practice there is not a straightforward progression - considerable iteration is required to ensure all objectives are met simultaneously. This is a difficult problem in its own right, called design closure.

• Logic synthesis: The RTL is mapped into a gate-level netlist in the target technology of the chip.
• Floorplanning: The RTL of the chip is assigned to gross regions of the chip, input/output (I/O) pins are assigned and large objects (arrays, cores, etc.) are placed.
• Placement: The gates in the netlist are assigned to nonoverlapping locations on the die area.
• Logic/placement refinement: Iterative logical and placement transformations to close performance and power constraints.
• Clock insertion: Clock signal wiring is (commonly, clock trees) introduced into the design.
• Routing: The wires that connect the gates in the netlist are added.
• Postwiring optimization: Performance (timing closure), noise (signal integrity), and yield (Design for manufacturability) violations are removed.
• Design for manufacturability: The design is modified, where possible, to make it as easy and efficient as possible to produce. This is achieved by adding extra vias or adding dummy metal/diffusion/poly layers wherever possible while complying to the design rules set by the foundry.
• Final checking: Since errors are expensive, time-consuming and hard to spot, extensive error checking is the rule, making sure the mapping to logic was done correctly, and checking that the manufacturing rules were followed faithfully.
• Chip finishing with Tapeout and mask generation: the design data is turned into photomasks in mask data preparation.^[3]

Coping with variability

A challenge most critical to analog IC design involves the variability of the individual devices built on the semiconductor chip. Unlike board-level circuit design which permits the designer to select devices that have each been tested and binned according to value, the device values on an IC can vary widely which are uncontrollable by the designer. For example, some IC resistors can vary ±20% and β of an integrated BJT can vary from 20 to 100. In the latest CMOS processes, β of vertical PNP transistors can even go below 1. To add to the design challenge, device properties often vary between each processed semiconductor wafer. Device properties can even vary significantly across each individual IC due to doping gradients. The underlying cause of this variability is that many semiconductor devices are highly sensitive to uncontrollable random variances in the process. Slight changes to the amount of diffusion time, uneven doping levels, etc. can have large effects on device properties.

Some design techniques used to reduce the effects of the device variation are:^[5]

• Using the ratios of resistors, which do match closely, rather than absolute resistor value.
• Using devices with matched geometrical shapes so they have matched variations.
• Making devices large so that statistical variations becomes an insignificant fraction of the overall device property.
• Segmenting large devices, such as resistors, into parts and interweaving them to cancel variations.
• Using common centroid device layout to cancel variations in devices which must match closely (such as the transistor differential pair of an op amp).